Explore our core capabilities below — switch tabs inside any card to inspect technical specs and deliverables, or launch its live simulator.
Full-spectrum analog, digital, and mixed-signal circuit design from component selection to simulation and schematic capture.
High-speed digital, RF, and multi-layer PCB layouts engineered for manufacturability with DFM/DFA and impedance control.
Comprehensive design for manufacturing review to identify potential fabrication issues before production, saving time and money.
Fast-turn PCB prototyping and turnkey assembly services. Test your designs with functional prototypes before full production.
Simulate your power rail current, high-frequency IC decoupling capacitor (D-Cap) network, and IEC 61000-4-5 surge protection requirements.
Includes hierarchical schematic capture, worst-case SPICE thermal verification, and low-ESR X7R decoupling placement guide.
Select layer count on a 1.6 mm FR-4 substrate with 35 µm finished copper to inspect trace geometry for 50Ω, 90Ω, and 100Ω lines.
Test your PCB design rules against standard fabrication capabilities and electrical safety clearance standards.
Configure your prototype quantity, assembly type, and surface finish to preview turnaround milestones.
Includes laser-cut stainless steel SMD stencil, automated pick-and-place reflow, and power-on hardware validation.
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